Discharge machining technology using multi-wire and other methods for SiC wafer slicing.
★What is the promising discharge slicing technology for SiC wafer slicing!? ★You can learn the basics of discharge machining!!
Target Audience: Engineers, researchers, departments, and beginners interested in discharge machining basics and promising discharge slicing technology for SiC wafer slicing. Venue: Kawasaki City Educational and Cultural Center, Room 1【Kanagawa, Kawasaki】 Access: 12-minute walk from JR or Keikyu Line Kawasaki Station Date and Time: October 31, 2011 (Monday) 13:30-16:30 Capacity: 30 participants. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people per company. *Limited to Tech-Zone members who apply by October 17. Membership registration is free. *After October 17, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people per company.
- Company：AndTech
- Price：10,000 yen-100,000 yen
